Blocky shape & high toughness  Concentrated particle size distribution Long wear-resistance High purity & cleanliness Lapping, Grinding the hard and brittle material

Block structure, regular crystal form Uniform particle size distribution Good thermal stability, high wear resistance Used for Used for silicon wafer cutting diamond wire Jewelry diamond wire saw, semiconductor saw e...

Irregular Shape & Low toughness Uniform particle size distribution Self-sharpness  Cost-effective Choice Lapping, Grinding the hard and fragile material

Block structure, regular crystal form Uniform particle size distribution Good thermal stability, high wear resistance Used for sintered PDC tools and drawing dies

Semi-Blocky Shape  Uniform particle size distribution Medium toughness High grinding performance Lapping, Grinding the hard and fragile material

Rough and sharp surface Brittle monocrystal structure Concentrated particle size distribution Low magnetic susceptibility Low impurities and excellent brittleness Self-sharpness, high cutting effi...